Frequently Asked Questions (FAQ)
Q1: What makes Mold Lite Plus products of choice?
Mold Lite Plus technology does not contain Methanol, a known HAP for many foundries. It also incorporates newer, cost effective refractories in its formulations
Q2: Can I reduce Mold Lite Plus with ethanol?
Mold Lite Plus is designed for IPA based reduction only.
Q3: What is the difference with the “Z” Formula, “TZ” Formula and the “T” formula?
The Z formula contains 100% Zircon as its refractory. The TZ formula contains a blend of Tabular Alumina and Zircon to promote a more cost effective, yet robust system. The “T” formula is 100% Tabular Alumina and is the most cost competitive of the Mold Lite Plus products.
Q4: How is Mold Lite Plus applied?
Mold Lite Plus can be flowcoated, sprayed, dipped and brushed.
Q5: What are the current packaging options?
HAI’s current packaging for Mold Lite Plus is in drums and pails.
Q6: Will the Mold Lite Plus series work on different types of sand systems and binder systems?
Yes, Mold Lite Plus is designed for all No Bake resin systems.